The package of electronic components is necessary and crucial for chips.
Packaging can also be said to refer to the shell for installing semiconductor integrated circuit chips. It not only plays a role in protecting the chip and enhancing thermal conductivity.
In addition, it is also the role of the bridge and specifications of the internal circuits and external circuits of the chip.
There are many types of electronic components, capacitor resistance, inductance, triode, diode, and ICs with different functions, etc., and will have different packaging.
Common electronic components
Resistor: It is used to limit current, separate pressure, match circuit, etc.
Capacics (CAPACITOR): used to store charge, filter, isolation DC and AC power
Induction (INDUCTOR): Storage and release of energy through changes in current, participating in frequency selection, filtering and other applications
Diode: used to control the flow direction of the current, which is often used in rectification, switches and protection circuits
Crystal pipes (transistor): used for current amplification and control, often used in circuits such as logic doors, amplifiers, switches and oscillars
Rectifier: Convert AC power to DC electricity
Potentiometer: Used to adjust the resistance value, generally used to control current or voltage
Reiay: The switch device used to control high -power circuits
Power management IC (PMIC): for power management and monitoring, including voltage regulators, switching power supply, battery management, etc.
Integrald Circuit, IC: IC: Integrate multiple electronic components on one chip, such as computing amplifiers, microprocessors, memory, etc.
Common forms of packaging
SOP/SOIC encapsulation
SOP is the abbreviation of English Small Outline Package, that is, a small shape package.
DIP is the abbreviation of English Double In-Line Package, that is, dual-column direct-inserted packaging.
One of the packaged packaging, the pins are led from the sides of the packaging, and the packaging materials include plastic and ceramic.
PLCC is an abbreviation of English Plastic Leaded Chip Carrier, that is, plastic sealing J -lead chip packaging.
The PLCC packaging method, the shape is square, the 32 -pin is encapsulated, the feet are surrounded by, and the outer size is much smaller than the DIP packaging.
BGA is abbreviated by the English Ball Grid Array Package, that is, the ball grid array is encapsulated.
Compared with the traditional TSOP packaging method, the BGA packaging method has a faster and effective heat dissipation pathway.
QFP is the abbreviation of Quad Flat Package, that is, the plane package of small blocks.
To represent the transistor outline, it was originally a transistor packaging, which aims to enable the lead to be processed and used for surface stickers.
Even if it has the same shape as T0, different manufacturers may use different names.
SOT (Small Outline Transistor), a small -appearance transistor, a SOP series packaging.
